English English
Restore
Home > Products > Lapping Machines > Dual Face Lapping Machines

Dual Face Lapping Machines

Dual Face Lapping Machines is a device that can grind and polish two sides at the same time. It is mainly used to improve the parallelism, flatness and roughness of the product.

Application of Dual Face Lapping Machines: It is used for double-sided grinding and polishing of stainless steel, aluminum plate, copper sheet, cemented carbide and other metal materials and optical glass, sapphire substrate, quartz sheet, ceramics and other non-metallic materials.

The Working Principle of Dual Face Lapping Machines:

1). The upper and lower grinding discs rotate in opposite directions, and the workpiece moves in the carrier with both revolution and rotation. The grinding resistance is small and does not damage the workpiece, and the two sides are evenly ground and the production efficiency is high.
2). You can choose to add a grating thickness control system, and the thickness tolerance of the processed product can be controlled.
3). The device of double-sided grinding machine includes two grinding discs, carrier, four motors, sun wheel, etc.
4). The structure of the Dual Face Lapping Machines is relatively complicated and the structure is more stable.
5). The efficiency of the Dual Face Lapping Machines is relatively high.

  • TY-9B Two-sided Grinder for Sapphire grind & polish both flat faces of the components at the same time.It is widely used for Quartz wafers, ceramics(Aluminum oxide, zirconium oxide, aluminum nitride, beryllium oxide, boron nitride, silicon nitride, silicon carbide, silicon nitride, indium sulfide, bismuth telluride, barium titanate, strontium titanate,、piezoelectric ceramics), optical glass, sapphire, alloy steel, stainless steel, tungsten steel, iron and other metals or non-metals.

    Read More Send Inquiry More

  • TY-6B Dual Face Lapping&Polishing Machines grind & polish both flat faces of the components at the same time. It is widely used for Quartz wafers, ceramics(Aluminum oxide, zirconium oxide, aluminum nitride, beryllium oxide, boron nitride, silicon nitride, silicon carbide, silicon nitride, indium sulfide, bismuth telluride, barium titanate, strontium titanate,、piezoelectric ceramics), optical glass, sapphire, alloy steel, stainless steel, tungsten steel, iron and other metals or non-metals.

    Read More Send Inquiry More

  • The Double Side Lapping Machines can grind silicon wafers, optical glass, aluminum alloys, titanium alloys, tungsten steel, stainless steel and other materials on both sides with high precision.

    Read More Send Inquiry More
 1 
+86-13622378685
grace@lapping-machine.com