The polishing machine is a kind of equipment that improves the surface roughness of the product, and can also remove the surface texture, scratches, spots, orange peel, etc. It is a refined surface treatment equipment. It is often used for mirror polishing of stainless steel, aluminum alloy, tungsten steel, cemented carbide and other metal materials, and also used to improve the smoothness level of non-metallic materials such as silicon wafer, sapphire, silicon carbide, lithium tantalate,optical glass.
The polishing machine is used after the rough grinding of the product, and it is the last surface treatment process of the product.After the processing is completed, it can be a mirror surface or a sub-mirror surface. The finish is between 0.02um-0.001um.
The standard for measuring the accuracy of a olishing machine is the roughness. The roughness of the polishing machine produced by Tengyu can reach up to 1nm!
TY-13-6B Double Side Polisher grind, lapping & polish both flat faces of the components at the same time.It is widely used for Sapphire substrate,Silicon Wafers,Filter Glass, optical glass, Sapphire Watch Glass,aluminum, copper, stainless steel, bearing steel, ceramics, quartz crystal, other materials, etc.
It is suitable for surface grinding of high-precision large workpieces. Such as: plastic plate, ceramic, nickel alloy, zinc alloy plate, tungsten steel plate, aluminum alloy, stainless steel, engine case, light guide plate, etc.
What Double Side Lapping Machines can do? Applicable to thin hard and brittle materials such as metal sealing rings, sapphire, SiC, ceramics, glass grinding and polishing process, four-stage pressure control, to avoid damage to the processing of materials.
The single side polisher is widely used for single-sided grinding and polishing of alumina ceramics, Zirconia ( PSZ) Ceramics,SiC Ceramics, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, seal ring, Stainless Steel, Titanium Alloy, Cemented Carbide, Tungsten Steel etc.
What the Semiconductor Silicon Wafer Polishing Machines Can Do? It is used for: • silicon wafer • lithium tantalate • Ceramic substrate • Silicon carbide wafer and other semiconductor materials
Small Polishing Machine for experiment is widely used in LED sapphire substrates, optical glass wafers, ceramics, quartz wafers, molds, compressor valves, hydraulic seals, light guide plates, optical skewer joints.