grace@lapping-machine.com
+86-13622378685

Fully Automatic Vertical Wafer Grinding Machine

Full-Auto Wafer Grinder
Full-Auto Wafer Grinder series is the core facility specialized in wafer fabrication. Thru several years of research and study in wafer grinding, we are familiar with more than twenty kinds of grinding solutions including first to fourth generation of semiconductors.
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Silicon Carbide Wafer Thinning Machine
Silicon Carbide Wafer Thinning Machine is mainly used for thinning of substrate materials such as silicon wafer, gallium arsenide, silicon carbide ceramics, zirconia ceramics, graphite, lithium tantalate and so on.
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High Precision Vertical Wafer Grinding Machines
The high precision vertical wafer grinding machines can grind third generation semiconductor materials such as SiC, GaN, GaAs, Si, ZnO. DL-GSD series is a self-made grinding machine in China, and its performance has reached the world standard.
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Full Automatic Wafer Grinder
Full Automatic Wafer Grinder is a kind of high precision and high efficiency grinding equipment, mainly used in semiconductor, optoelectronics, microelectronics and other fields of wafer processing.
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+86-13622378685

grace@lapping-machine.com