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High Precision Vertical Wafer Grinding Machines

High Precision Vertical Wafer Grinding Machines

The high precision vertical wafer grinding machines can grind third generation semiconductor materials such as SiC, GaN, GaAs, Si, ZnO. DL-GSD series is a self-made grinding machine in China, and its performance has reached the world standard.Keywords:Advanced, Manufacturers, Factory, Customized, In Stock, Quotation, High Precision, Easy-maintainable

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Product Description

This is a high-efficiency grinder/polisher for wafers.


1. What Can The High Precision Vertical Wafer Grinding Machines Do？


The high precision vertical wafer grinding machines can grind third generation semiconductor materials such as SiC, GaN, GaAs, Si, ZnO. DL-GSD series is a self-made grinding machine in China, and its performance has reached the world standard.


2. What Does The High Precision Vertical Wafer Grinding Machines Consist Of？


1). DL-ES55 Series Hydrostatic air-floating electric spindle。

Advantages: Air bearing has high rigidity, low vibration, low thermal expansion and small speed change.

Air-floating electric spindle adopts rigid microporous material as the air flotation block, and the spindle accuracy, life, air permeability and stability are in the forefront of the world spindle products. 




2). Manipulator



3). Hydrostatic air bearing work turntable




4). NCG（Non Contact Gauge）
advantage: 
Non-contact, reduce fragmentation rate
More accurate, can measure wafer thickness after de-adhesive
Spec: Accuracy ≤ 1 μm

Repeatability 0.1 μm






3. Easy operation


Equipped with a touch-type liquid crystal display and GUI (Graphical User Interface) to improve the convenience of operation. The control screen can simultaneously display the processing status and equipment status.






4. How The High Precision Vertical Wafer Grinding Machines works?


1). Place the wafer cassette on the material table, and the material table automatically calibrates the wafer cassette。

2). The manipulator grabs the wafer from the wafer cassette and transfers it to the wafer guiding stage; the guiding stage positions and guides the wafer.
3). The main turntable rotates to station A for grinding, NCG detects the wafer thickness and automatically compensates the feed amount。
4). The main turntable rotates to station B for polishing, and NCG detects the wafer thickness and automatically compensates the feed amount.
5). The main turntable rotates to station C for cleaning and drying。

6). Robot returns the cleaned wafer to the wafer cassette.





5. Specifications For High Precision Vertical Wafer Grinding Machines


Specification

Unit

DSG200A

DSG300A

Wafer Diameter

inch

4”, 6”, 8”

8”, 12”

Grinding Method

-

In-feed grinding with wafer Rotation

Grinding Wheels

mm

 Diamond wheel (grinding-axis)

Polishing pad

（CMP pad）

 

Diamond wheel (grinding-axis)

Polishing pad

（CMP pad） 

 

grinding-axis

rated power

KW

~4

5.5

Rated speed

r/min

1000~7000

1000~4000

Precision

Flatness

μm

< 1.5

< 3

roughness

μm

Ry 0.13(with #2000 finish)

Ry 0.15(with #1400 finish) 

Machine dimensions(WxDxH)

mm

2500x4500x1800

Weight

KG

Approx.4000KG

Approx.5000KG


6.  The Factory of Shenzhen Tengyu Grinding Technology Co., Ltd.







Shenzhen Tengyu Grinding Technology Co., Ltd. was located in Guangming New District, Shenzhen, China, with a registered capital of 5 million yuan, which plant area is about 13,000 square meters. It is an enterprise engaged in surface grinding and polishing technology. The company specializes in R&D, production and sales of various high-precision flat grinding equipment, flat polishing equipment, high-speed thinning equipment, 3D polishing equipment and its supporting consumables. Its products are widely used in precision processing of mechanical seals, electronic communications, ceramics, semiconductors, optical crystals, aerospace, automotive mold, LED, mobile phone accessories, hardware and other components. The customer base is spread all over the country and abroad, and its representatives include TF, MEEYA, Tongda Group, Hanslaser, and many other well-known companies.


7. FAQ

Q1: Are you trading company or manufacturer?
A: We're manufacturer. We have our own factory and experienced technicians.

Q2: What is your terms of payment?
A: T/T 30% as deposit, and 70% before delivery. We'll show you the photos of the products and packages before you pay the balance.

Q3: What is your terms of delivery and delivery time?
A:EXW, FOB, CFR, CIF, DDU, etc. Generally, it will take 7 to 20 days after receiving your advance payment.The specific delivery time depends on the items and the quantity of your order.

Q4: Could you provide technology support?
A: We're in this field more than 20 years. If there's any problem, please contact with us, we'll provide suggestion from our engineer to help you solve problem.

Q5: What is the MOQ of customized products?
A: We are manufacturer and can provide you small MOQ for customized products.

Q6: Do you test all your goods before delivery?
A: Yes, every products will be test before delivery.

Q7: How do you make our business long-term and good relationship?
A.:We keep good quality and competitive price to ensure our customers’ benefit, and we respect every customer as our friend and we sincerely do business and make friends with them, no matter where they come from.

Q8: Is there any quality guarantee?
A: We offer one year quality guarantee. We are responsible for the quality of our mechanical seals. 

Related Category

Fully Automatic Vertical Wafer Grinding Machine

Semi-Automatic Wafer Grinding Machine

Horizontal Wafer Grinding Machine

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