Wafer Grinder

Wafer Grinder are used in the semiconductor industry, which can quickly thin wafers, and can also be used to thin other ultra-thin materials. Such as silicon wafers, silicon carbide, sapphire, gallium arsenide, gallium nitride, ceramics, lithium tantalate, lithium niobate, indium sulfide, barium titanate, molding compound, chips, etc.

The advantages of the wafer grinder produced by Tengyu:

1). High roduction efficiency, the maximum grinding wheel speed can reach 3000rpm;

2). The thickness of 2.6-inch wafer can be 60um;

3). The thickness can be effectively controlled, and the thickness tolerance can be controlled within ±0.005;

4). Flatness and parallelism are much higher than ordinary grinders;

5). The program is precisely controlled and the operation is simple.
6). Vacuum adsorption, the product is firmly fixed and not easy to be broken.

Wafer grinder are divided into two types: semi-automatic and fully automatic. Among them, there are many models of semi-automatic, including basic models, air-floating spindle models, dual-axis models, and single-axis models, each with different functions and accuracy. If you need it, please consult our customer service in detail to confirm the most suitable model for you.

The wafer grinder produced by Tengyu has been put on the market for many years. Due to its wide application, the thinned products have high precision, long service life and low failure rate, and have won unanimous praise from customers.

We are a manufacturer of wafer grinder in China, and our wafer grinders are exported to Malaysia, Singapore, Indonesia, Thailand, South Korea, Taiwan, Russia and other countries.

Full-Auto Wafer Grinder
Full-Auto Wafer Grinder series is the core facility specialized in wafer fabrication. Thru several years of research and study in wafer grinding, we are familiar with more than twenty kinds of grinding solutions including first to fourth generation of semiconductors.
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Dual Spindle Wafer Grinder
The outline and load-bearing structure adopt our latest cast iron frame, marble platform and support structure, and the support of the grinding wheel spindle is made of sand casting.
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Silicon Carbide Wafer Thinning Machine
Silicon Carbide Wafer Thinning Machine is mainly used for thinning of substrate materials such as silicon wafer, gallium arsenide, silicon carbide ceramics, zirconia ceramics, graphite, lithium tantalate and so on.
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Wafer Processing Equipment
The Applications of The Wafer Processing Equipment:Semiconductor wafer grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP.
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Ultra-Thin Grinding
The Applications of The Ultra-Thin Grinding:Ultra-Thin Grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP.
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Semiconductor Wafer Grinder
The Applications of The Semiconductor Wafer Grinder: Semiconductor wafer grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP. • Ultra-precision optical components, such as： ULE glass, High-energy particle scintillator, Fluorescent film, Projection glass.
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