Dual Spindle Wafer Grinder

1. Product Parameter of Dual Spindle Wafer Grinder

2. Product Feature of Dual Spindle Wafer Grinder

The outline and load-bearing structure adopt our latest cast iron frame, marble platform and support structure, and the support of the grinding wheel spindle is made of sand casting. Compared with the traditional weldment, this structure has higher strength and better precision. At present, foreign high-precision equipment has adopted this design.

Additional mist exhaust axial flow fan on the top

A grinding wheel waterproof cover and a second-layer waterproof cover are added to reduce the emission of a large amount of water mist during grinding.

It adopts the fine grinding screw guide rail module and the vacuum Sucker spindle to switch back and forth between the rough grinding and fine grinding positions. It also has the function of non-contact online thickness gauge.

3. Product Structure of Dual Spindle Wafer Grinder

This machine is mainly composed of machine base, bed, vacum Sucker, Sucker spindle, grinding wheel spindle, grinding wheel feeding mechanism, online measurement system, control system, etc.

1. The base of the machine is made of ductile iron precision casting, and the body is made of high-rigidity marble， so that the accuracy can be maintained for many years,

2. The equipment adopts two grinding wheel spindles, which can realize coarse grinding and fine grinding at the same time.

3. Two 10-inch diamond grinding wheels are used, and the grain size of the grinding wheels can be selected according to product requirements.

4. The spindle of the Sucker moves left and right through the precision screw guide rail and the servo motor to realizocarse grinding and fine grinding.

5. Vacuum Sucker are customized according to product requirements.

6. The grinding wheel feed mechanism adopts THK precision screw rod, guide rail, Mitsubishi servo motor to drive the grinding wheel spindle to achieve fine grinding.

7. This machine adopts a non-contact online measuring instrument, the purpose is to measure the thickness of the product in a timely manner.

8. The control system adopts Mitsubishi PLC, servo motor, touch screen, etc.

1. The equipment can store 20 sets of processing data of different products, which e can be called out directly when in use. New products need to reset the parameters and save them.

2. Processing flow: manually put the product into the designed vacum Sucker, set the final thickness of the product, coarse grinding thickness, fine grinding thickness, coarse grinding efficiency/second, fine efficiency/second, coarse grinding spindle torque. Fine grinding spindle torque. After the above data is set, start the button, and the equipment will start to work. During the working process of the equipment, it will automatically measure the thickness of the product for precise grinding. First, coarse grinding. After the coarse grinding is completed, the Sucker spindle will automatically transfer to the fine grinding. Completion of equipment automatic alarm to show that all work processes are completed.

You can contact us in the following ways:

Tel:+86 13622378685
Whatsapp:+86 13622378685

WhatsAPP Business: +86 13622378685
Web:www.lapping-machine.com
E-Mail:grace@lapping-machine.com
Add:Building 34, Yuanshan Industrial Zone B, Guangming, Shenzhen, China  518106

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