What Double Side Lapping Machines can do? Applicable to thin hard and brittle materials such as metal sealing rings, sapphire, SiC, ceramics, glass grinding and polishing process, four-stage pressure control, to avoid damage to the processing of materials.
Equipment Name: FD-15B Precision Double Sided Grinder Equipment use: This machine is mainly used for semiconductor materials, optical glass, magnetic materials, dielectrics, piezoelectric materials, polycrystalline materials, non-polycrystalline materials, High-precision grinding and polishing of ceramic sheets, ultra-thin metal materials and other hard and brittle materials.