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Horizontal Wafer Grinding Machine

  • Wafer grinder for resin material is very suitable for products with relatively high hardness, ultra-thin thickness and high degree of precision in flatness and surface quality. The compact design with advanced controls and process monitoring makes this an ideal machine for use in research & development or for low volume production of advanced components.

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  • Wafer Grinder Ceramic substrate is very suitable for products with relatively high hardness, ultra-thin thickness and high degree of precision in flatness and surface quality. The compact design with advanced controls and process monitoring makes this an ideal machine for use in research & development or for low volume production of advanced components. 

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