Wafer Grinder Ceramic Substrate

1. Main Purpose of The Wafer Grinder Ceramic Substrate

Wafer Grinder Ceramic substrate is very suitable for products with relatively high hardness, ultra-thin thickness and high degree of precision in flatness and surface quality.  The compact design with advanced controls and process monitoring makes this an ideal machine for use in research & development or for low volume production of advanced components. 

 plastic

2. M.A.D. Technology 

3. Advanced Control Options 

1). The thickness of the 150-diameter wafer can be reduced to 100um thick without breaking.

5. Optional additional items：

（Notice：If you need to install the above two items, please put forward before purchasing the equipment.）

6. Technical Parameter of The Wafer Grinder Ceramic Substrate

7.  The Factory of Shenzhen Tengyu Grinding Technology Co., Ltd.

Shenzhen Tengyu Grinding Technology Co., Ltd. was located in Guangming New District, Shenzhen, China, with a registered capital of 5 million yuan, which plant area is about 13,000 square meters. It is an enterprise engaged in surface grinding and polishing technology. The company specializes in R&D, production and sales of various high-precision flat grinding equipment, flat polishing equipment, high-speed thinning equipment, 3D polishing equipment and its supporting consumables. Its products are widely used in precision processing of mechanical seals, electronic communications, ceramics, semiconductors, optical crystals, aerospace, automotive mold, LED, mobile phone accessories, hardware and other components. The customer base is spread all over the country and abroad, and its representatives include TF, MEEYA, Tongda Group, Hanslaser, and many other well-known companies.

8. FAQ

Q1: Are you trading company or manufacturer?
A: We're manufacturer. We have our own factory and experienced technicians.

Q2: What is your terms of payment?
A: T/T 30% as deposit, and 70% before delivery. We'll show you the photos of the products and packages before you pay the balance.

Q3: What is your terms of delivery and delivery time?
A:EXW,FOB,CFR,CIF, DDU, etc.Generally, it will take 7 to 20 days after receiving your advance payment.The specific delivery time depends on the items and the quantity of your order.

Q4: Could you provide technology support?
A: We're in this field more than 20 years. If there's any problem, please contact with us, we'll provide suggestion from our engineer to help you solve problem.

Q5: What is the MOQ of customized products?
A: We are manufacturer and can provide you small MOQ for customized products.

Q6: Do you test all your goods before delivery?
A: Yes, every products will be test before delivery.

Q7: How do you make our business long-term and good relationship?
A.:We keep good quality and competitive price to ensure our customers’ benefit, and we respect every customer as our friend and we sincerely do business and make friends with them, no matter where they come from.

Q8: Is there any quality guarantee?
A: We offer one year quality guarantee. We are responsible for the quality of our mechanical seals. 

Fully Automatic Vertical Wafer Grinding Machine

Semi-Automatic Wafer Grinding Machine

Horizontal Wafer Grinding Machine