grace@lapping-machine.com
+86-13622378685

Semi-Automatic Wafer Grinding Machine

Dual Spindle Wafer Grinder
The outline and load-bearing structure adopt our latest cast iron frame, marble platform and support structure, and the support of the grinding wheel spindle is made of sand casting.
Read More Send Inquiry More
Wafer Processing Equipment
The Applications of The Wafer Processing Equipment:Semiconductor wafer grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP.
Read More Send Inquiry More
Ultra-Thin Grinding
The Applications of The Ultra-Thin Grinding:Ultra-Thin Grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP.
Read More Send Inquiry More
Semiconductor Wafer Grinder
The Applications of The Semiconductor Wafer Grinder: Semiconductor wafer grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP. • Ultra-precision optical components, such as： ULE glass, High-energy particle scintillator, Fluorescent film, Projection glass.
Read More Send Inquiry More

1

+86-13622378685

grace@lapping-machine.com