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Ultra-Thin Grinding

Ultra-Thin Grinding

The Applications of The Ultra-Thin Grinding:Ultra-Thin Grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP. Keywords:Advanced, Manufacturers, Factory, Customized, In Stock, Quotation, High Precision, Easy-maintainable

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Product Description


1. The Applications of The Ultra-Thin Grinding:


Semiconductor wafer grinding or back-thinning of advanced materials, such as: 

SiC, GaAs, Sapphire, Si, GaN, InP.
• Ultra-precision optical components, such as:
ULE glass, High-energy particle scintillator, Fluorescent film, Projection glass.


• Ceramic substrate, such as:

Al2O3, AlN, CaF2, ZnSe, carbide, ZrO₂, BaTiO3, SrTiO3, PbTiO3, LiNbO3, CdTe, CdS, Ca2Sx, Al2O3CrNd, etc.


• semiconductor advanced packaging, such as :

ceramic, polyimide, Resin material.




2. The Uses of The Ultra-Thin Grinding:


Ultra-Thin Grinding can be used to quickly thin the product, improve the surface quality of the product, and increase the flatness and parallelism,and can effectively control the thickness, can achieve a higher thickness tolerance.


Equipment composition of The Ultra-Thin Grinding :

Vacuum suction cup, Spindle, Drive mechanism, grinding wheel, Feeding mechanism, Fully closed loop control system,etc.


3. Way to control:


1). This machine adopts advanced international well-known brand PLC and touch screen, with high degree of automation, realizes man-machine interface, and the operation is simple and clear at a glance.
2). Air pressure detection sensor, when the air pressure is lower than the minimum pressure set by the equipment for normal processing, the equipment will alarm to prevent the workpiece from being sucked firmly.
3). Grinding wheel torque control, when the torque is higher than the torque generated by the normal processing set by the equipment, the equipment will alarm to prevent the machine parts from being damaged by the tool when the equipment is abnormal or misoperation.
4). The grinding wheel current monitoring, when the cold grinding wheel is higher than the maximum current generated by the normal processing set by the equipment, the grinding wheel rebounds, and the rebound distance can be adjusted to prevent the grinding wheel from squeezing the workpiece and causing damage.
5). The automatic compensation of the wear of the grinding wheel prevents the consumption of the grinding wheel while grinding the product from affecting the processing accuracy of the workpiece.


4. Optional additional items:


1). Automatic grinding wheel online dressing
2). Online thickness measurement system
(Notice:If you need to install the above two items, please put forward before purchasing the equipment.)

5. The Advantages of The Ultra-Thin Grinding


The thickness of the 4/6 inch silicone wafer can be reduced to 80um thick without breaking.

6. Technical Parameter of The Ultra-Thin Grinding


Model

TY-GD6

TY-GD12

TY-GD22

Maximum processing size

Φ150

Φ300

Φ550

Wheel speed

0-3000rpm/min

0-3000rpm/min

0-3000rpm/min

Wheel motor power

5.5kw

5.5kw

5.5kw

Sucker speed

0-300rpm/min

0-300rpm/min

0-300rpm/min

Sucker power

1.5KW  220V

1.5KW  220V

1.5KW  220V

Grating control system

Resolution 0.001mm

Resolution 0.001mm

Resolution 0.001mm

Flatness

3um(4 inch)

3um(4 inch)

3um(4 inch)

Parallelism

3um(4 inch)

3um(4 inch)

3um(4 inch)

Thickness tolerance

2um(4 inch)

2um(4 inch)

2um(4 inch)

Minimum thickness

100um

100um

100um

Minimum setting step of grinding wheel

0.1um/s

0.1um/s

0.1um/s

Water tank size

780*480*550mm

780*480*550mm

780*480*550mm

Equipment size

1010*1210*2070mm

1010*1210*2070mm

1010*1210*2070mm

weight

1200KG

1200KG

1200KG


7.  The Factory of Shenzhen Tengyu Grinding Technology Co., Ltd.







Shenzhen Tengyu Grinding Technology Co., Ltd. was located in Guangming New District, Shenzhen, China, with a registered capital of 5 million yuan, which plant area is about 13,000 square meters. It is an enterprise engaged in surface grinding and polishing technology. The company specializes in R&D, production and sales of various high-precision flat grinding equipment, flat polishing equipment, high-speed thinning equipment, 3D polishing equipment and its supporting consumables. Its products are widely used in precision processing of mechanical seals, electronic communications, ceramics, semiconductors, optical crystals, aerospace, automotive mold, LED, mobile phone accessories, hardware and other components. The customer base is spread all over the country and abroad, and its representatives include TF, MEEYA, Tongda Group, Hanslaser, and many other well-known companies.


8. FAQ

Q1: Are you trading company or manufacturer?
A: We're manufacturer. We have our own factory and experienced technicians.

Q2: What is your terms of payment?
A: T/T 30% as deposit, and 70% before delivery. We'll show you the photos of the products and packages before you pay the balance.

Q3: What is your terms of delivery and delivery time?
A:EXW, FOB, CFR, CIF, DDU, etc. Generally, it will take 7 to 20 days after receiving your advance payment.The specific delivery time depends on the items and the quantity of your order.

Q4: Could you provide technology support?
A: We're in this field more than 20 years. If there's any problem, please contact with us, we'll provide suggestion from our engineer to help you solve problem.

Q5: What is the MOQ of customized products?
A: We are manufacturer and can provide you small MOQ for customized products.

Q6: Do you test all your goods before delivery?
A: Yes, every products will be test before delivery.

Q7: How do you make our business long-term and good relationship?
A.:We keep good quality and competitive price to ensure our customers’ benefit, and we respect every customer as our friend and we sincerely do business and make friends with them, no matter where they come from.

Q8: Is there any quality guarantee?
A: We offer one year quality guarantee. We are responsible for the quality of our mechanical seals. 

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