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Cu Lapping&Polishing Machine

  • Applicable to Sapphire or SIC super-hardcover material polishing process, man-machine interface to facilitate the operation, the body to strengthen the support bar design, higher stability, with water cooling function.

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  • The Sapphire Lapping And Polishing Process And Machines is used for: • Sapphire substrate/wafer • Semiconductor wafer: silicon carbide, 12-inch silicon wafer, lithium tantalate, lithium niobate, etc. • Tungsten carbide parts • Ceramic parts • Valves • crystal glass • Oscillator part

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  • What the Lapping & Polishing Machines Can Do? Lapping & Polishing is used for: • 4,6,8,12-inch silicon wafer • Sapphire substrate/wafer • Tungsten carbide parts • Ceramic parts • Valves • crystal glass • Silicon carbide wafer

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