1. Main Purposes of The Silicon Carbide Wafer Thinning Machine:
This equipment is mainly used for thinning of substrate materials such as silicon wafer, gallium arsenide, silicon carbide ceramics, zirconia ceramics, graphite, lithium tantalate and so on.
Longitudinal plunge grinding.
The maximum grinding size can reach φ200mm, backward compatible.
Grinding method: Through the wafer rotary feed grinding system, vertical plunge grinding is realized.
Spindle type: Air Turbine Spindles to ensure less vibration.
The maximum power of the spindle≥ 4KW.
The maximum speed of the spindle:3000r/min.
Z-axis resolution≤ 0.1µm.
The loading method of the wafer table is vacuum adsorption.
Type of wafer support table: porous ceramic wafer support table.
Equipped with a set of correction grinding wheel.
Equipped with diamond grinding wheel
Diamond grinding wheel (mm): φ200±10%
The grinding method is semi-automatic/automatic, touch-screen operation interface, PLC control, to prevent misoperation, and alarm in time when abnormality occurs.
The thickness measurement method is closed-loop thickness measurement.
Thickness variation TTV≤±5µm
The thickness variation between different sheets WTW≤±5µm
Finishing surface roughness (μm): Ra≤0.2μm (2000# grinding wheel, take silicon wafer as an example)
2. Machine Parameters of The Silicon Carbide Wafer Thinning Machine
Porous Ceramic Disc Dimensions |
Ø200mm |
The speed of the support table (continuously adjustable) |
0-300rpm/min |
Chassis motor power |
1.5KW |
Raster control system resolution |
0.0001mm |
Wheel speed (adjustable) |
0-3000rpm/min |
Grinding wheel spindle power |
5.5 kw |
Workpiece parallelism |
±0.003mm |
Workpiece thickness error |
±0.003mm |
Workpiece flatness |
±0.003mm |
Minimum thinning thickness of workpiece |
≥0.05mm/Φ100mm |
Grinding wheel repeatability |
0.002mm |
Grinding wheel minimum setting step |
0.001mm/s |
Dimensions |
1200*1100*2070mm |
weight |
1750KG |
3. Equipment Structure of The Silicon Carbide Wafer Thinning Machine
The equipment is mainly composed of frame, air spindle, porous ceramic suction cup (applicable to various types of tension rings), vacuum spindle gear motor, hydrostatic air suspension electric spindle, diamond grinding wheel, screw guide module, harmonic reducer, grinding wheel online dressing mechanism , Fully closed-loop servo control system, cutting fluid circulation system and other components.
4. Working Principle of The Silicon Carbide Wafer Thinning Machine
The product is sucked and rotated clockwise by the vacuum suction cup spindle mechanism, and then rotated counterclockwise by the hydrostatic air suspension motorized spindle mechanism equipped with diamond grinding wheels. With the cooperation of the system and the full closed-loop control system, the precise grinding control of the workpiece by the grinding wheel is finally realized.
5. Features of The Silicon Carbide Wafer Thinning Machine
1). The frame is made of high-quality ductile iron cast as a whole, and has passed the aging treatment for more than three years, which basically releases the internal stress of the material.
2). The vacuum spindle is made of stainless steel, which is not easily affected by thermal expansion, resulting in the accuracy of grinding dimensions.
3). The vacuum suction cup adopts microporous ceramic as suction plate and 99 alumina ceramic as suction cup base, which completely avoids the heating of the grinding fluid after processing for a period of time, which will cause the thermal deformation of the suction cup.
4). The vacuum spindle gear motor is composed of Delta servo motor and Delta servo special reducer.
5). The air-floating rotor of the hydrostatic air-suspension electric spindle is made of zirconia ceramics, which completely avoids the excessive air gap between the air-movement rotors caused by the expansion of the air-floating rotor due to the heat from the motor and reduces the rigidity of the spindle.
6). Screw guide module.
7). The harmonic reducer adopts well-known brands imported from Japan.
8). Grinding wheel online dressing mechanism, after the grinding wheel has been ground for a period of time, the grinding surface of the grinding wheel will be blocked and blunt, which will reduce the grinding efficiency and squeeze the product. Dressing can improve grinding efficiency.
9). Fully closed-loop grating control system: to ensure the precise monitoring and repair of the feed of the grinding wheel by the servo motor, with the cooperation of this system.
10). Grinding fluid circulation system: The grinding fluid in the production and processing process continuously cools the workpiece, the grinding wheel and the electric spindle through the circulating system. The grinding fluid can also improve the self-sharpening of the grinding wheel.
Optional additional items:
Online thickness measurement system
(Notice:If you need to install the above two items, please put forward before purchasing the equipment.)
6. The Factory of Shenzhen Tengyu Grinding Technology Co., Ltd.
Shenzhen Tengyu Grinding Technology Co., Ltd. was located in Guangming New District, Shenzhen, China, with a registered capital of 5 million yuan, which plant area is about 13,000 square meters. It is an enterprise engaged in surface grinding and polishing technology. The company specializes in R&D, production and sales of various high-precision flat grinding equipment, flat polishing equipment, high-speed thinning equipment, 3D polishing equipment and its supporting consumables. Its products are widely used in precision processing of mechanical seals, electronic communications, ceramics, semiconductors, optical crystals, aerospace, automotive mold, LED, mobile phone accessories, hardware and other components. The customer base is spread all over the country and abroad, and its representatives include TF, MEEYA, Tongda Group, Hanslaser, and many other well-known companies.
7. FAQ
Q1: Are you trading company or manufacturer?
A: We're manufacturer. We have our own factory and experienced technicians.
Q2: What is your terms of payment?
A: T/T 30% as deposit, and 70% before delivery. We'll show you the photos of the products and packages before you pay the balance.
Q3: What is your terms of delivery and delivery time?
A:EXW, FOB, CFR, CIF, DDU, etc. Generally, it will take 7 to 20 days after receiving your advance payment.The specific delivery time depends on the items and the quantity of your order.
Q4: Could you provide technology support?
A: We're in this field more than 20 years. If there's any problem, please contact with us, we'll provide suggestion from our engineer to help you solve problem.
Q5: What is the MOQ of customized products?
A: We are manufacturer and can provide you small MOQ for customized products.
Q6: Do you test all your goods before delivery?
A: Yes, every products will be test before delivery.
Q7: How do you make our business long-term and good relationship?
A.:We keep good quality and competitive price to ensure our customers’ benefit, and we respect every customer as our friend and we sincerely do business and make friends with them, no matter where they come from.
Q8: Is there any quality guarantee?
A: We offer one year quality guarantee. We are responsible for the quality of our mechanical seals.