Full-Auto Wafer Grinder

Full-Auto Wafer Grinder series is the core facility specialized in wafer fabrication. Thru several years of research and study in wafer grinding, we are familiar with more than twenty kinds of grinding solutions including first to fourth generation of semiconductors. Likewise, we have knowledge of relevant processing from sawing, chamfering, (de)bonding, (de)mounting, dicing, cleaning, to quality and performance measuring what indeed helped us to recognize the joint of with other processing working applicable and reliable with our equipment.

Sample

The series has been developed into semi and full automatic versions as to match different scenarios of use such as laboratory and fabrication line. Ponda provides the wo rid-forefront technical configurations and solutions for all series. On this basis, moreover, the machine can be modified to accomplish specified requirements by customization.

Si Wafer after Fine Grinding                  Sic Wafer after CMP

Technical Parameter:

Standard configuration:

Configuration Map:

Performance Data:

The vacuum tables within auto-model grinder are carried by a large ceramic aerostatic turntable to orbit around the central axis that passing down wafers between coarse grinding, fine grinding and mounting stations in order. Meanwhile, the aerostatic bearing mechanism is able to precisely brake and grip down the turntable at a specific angle by vacuum.

The triple-spindle model applies Stress Relief System(SRS). This system further enhances the roughness of output wafers and reduces uneven internal stress. On the other hand, it secures process yield at higher expectation. The system has two modalities that respectively are Dry Polishing(DSRS) and CMP(CSRS). Both are specialized in their own measured range of hardness, e.g. dry polishing has often been used in SiC wafers whereas CMP been used in Si.

AEROSTATIC B. SPINDLE:

The bearing layers of aerostatic bearing are a dry- clean inter-facial air film filled within the gap between rotor shaft and stator. Instead of regular bearing, it does not have actual contact with any part of mechanism when spinning. The aerostatic bearing utilizesrigid microporous substance which has been also called "Microporous Air Bearing". Such bearing provides extraordinarily long-lasting life-time and stability of the spindle among the others thereof. Bearing spindle is able to spin at extremely low amplitude at 3000 min-1 - radial and axial pulsate are less than 1/10 micron. than 1/10 micron.

Vacuum Table:

The vacuum table features auto-origin-homing due to a high-resolution servo motor. The model that applied with contact thickness gauge utilizes ceramic (AI2O3 or ZrO2) vacuum enclosure as for zeroing-point benchmark for the gauge. Otherwise it usually comes with stainless steel.

The vacuum area is optional to insert either single or universal vacuum clamp. Meanwhile, it has set blow-off function therefore to safely detach wafers also to clean up waste inside of the porous ceramic. The universal clamp can be applied from 2 to 12-inch clamp sections to adapt different diameters of wafers in one table and each section can be controlled individually. Meanwhile, we provide customized clamp for irregular-flat object as an option for choice.

A high-precision real-time thickness gauge is one of the most significant accessories in grinder as it straightly determines the constant grinding precision. Another advantage of it is to indicate accurate offset volume to grinder on the consumption of grinding wheel.

Diagram of operation principle of gauges

MARPOSS® high-precision-resolution contact and non-contact thickness gauges as options are configured for wafers' thickness inspection in different grinding conditions. [1] Contact gauge has two precision probes respectively making constant contact with wafer and ceramic enclosure while inspecting. The variation between the both inspected tops is the thickness of wafer(or with back tape). Normally for economic concern, it has been often applied in coarse grinding as it will leave hardly-seen circular imprint which can be eliminated in fine grinding. However, the target thickness under 150- micron is not recommended to use such gauge. [2]Non-contact gauge utilizes infrared technology by gathering the volume of ray absorption, reflection and dispersion of wafer to determine the true thickness which will not account the thickness of tape. It is necessary in finish polishing and ultra-thin grinding for wafer's safety concern.

As one of the most significant transportation apparatuses, the precision and stability of vacuum robot are our primary consideration when engineering. In a focused and targeted manner, the grinder has launched multiple specifically designed arms against different transportation stages.

Docking robot, as one of major I/O instruments, utilizes JEL® four-axis model and vacuum gripper. The robot itself can locate and transport the wafer in or out from the cassette A/B under communication with the sensors on cassette I/O dock.

Mounting and demounting robots are motivated by exclusive sets of high-resolution servo motors to swing and elevate. Both robots wield full-contact ceramic vacuum grippers and respectively undertake the routes of "wafer aligner — vacuum table" and "vacuum table — wafer cleaner & spinner".

Wafer Cleaner & Spinner: washes away remaining grinding waste and dry off the wafer. In a complete progress, the spin-table clamps wafer and spins rapidly while the nozzles lift down and spray DI water. Until the waste and coolant completely flushed and spun off, the table and air nozzle spins and sprays wafer to dry.

Fully Automatic Vertical Wafer Grinding Machine

Semi-Automatic Wafer Grinding Machine

Horizontal Wafer Grinding Machine