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Full Automatic Wafer Grinder

Full Automatic Wafer Grinder

Full Automatic Wafer Grinder is a kind of high precision and high efficiency grinding equipment, mainly used in semiconductor, optoelectronics, microelectronics and other fields of wafer processing.Keywords:Advanced, Manufacturers, Factory, Customized, In Stock, Quotation, High Precision, Easy-maintainable

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Product Description

1. Product Introduction of Full Automatic Wafer Grinder

Full Automatic Wafer Grinder is a kind of high precision and high efficiency grinding equipment, mainly used in semiconductor, optoelectronics, microelectronics and other fields of wafer processing. The equipment adopts advanced automation technology, which can realize automatic loading and unloading, automatic centering, automatic grinding and other functions of the wafer, greatly improving the production efficiency and processing accuracy.


2. Product Application of Full Automatic Wafer Grinder

Full Automatic Wafer Grinder is mainly used in semiconductor, optoelectronics, microelectronics and other fields of wafer processing, can be used for grinding silicon wafer, sapphire, silicon nitride, silicon carbide and other materials wafer processing.


3. Product Advantage of Full Automatic Wafer Grinder
1. High precision: Full Automatic Wafer Grinder adopts high precision grinding head and grinding disc, which can realize high precision grinding and ensure processing quality and product accuracy.
2. High efficiency: The equipment adopts automatic technology, which can realize automatic loading and unloading, automatic centering, automatic grinding and other functions of the wafer, greatly improving the production efficiency and processing accuracy.
3. Good stability: Full Automatic Wafer Grinder adopts high-quality mechanical structure and electrical control system, with good stability, low noise, long life and other characteristics, can meet the long-term, high-intensity production needs.

4. Easy operation: The equipment adopts man-machine interface operating system, easy to operate, easy to master, can quickly get started, improve the production efficiency and work efficiency.


4. Product Model of Full Automatic Wafer Grinder
There are many types of fully Full Automatic Wafer Grinder, which can be selected according to different processing needs and production scale. Common models are:
1. ATM-8100: Suitable for wafer processing of silicon wafer, sapphire, silicon nitride, silicon carbide and other materials, with a maximum diameter of 200mm.
2. ATM-8200: Suitable for wafer processing of silicon wafer, sapphire, silicon nitride, silicon carbide and other materials, with a maximum processing diameter of 300mm.

3. ATM-8300: Suitable for wafer processing of silicon wafer, sapphire, silicon nitride, silicon carbide and other materials, with a maximum processing diameter of 450mm.


Related Category

Fully Automatic Vertical Wafer Grinding Machine

Semi-Automatic Wafer Grinding Machine

Horizontal Wafer Grinding Machine

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