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Semiconductor Silicon Wafer Polishing Machines

Semiconductor Silicon Wafer Polishing Machines

What the Semiconductor Silicon Wafer Polishing Machines Can Do? It is used for: • silicon wafer • lithium tantalate • Ceramic substrate • Silicon carbide wafer and other semiconductor materialsKeywords:Advanced, Manufacturers, Factory, Customized, In Stock, Quotation, High Precision, Easy-maintainable

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Product Description


1. What the Semiconductor Silicon Wafer Polishing Machines Can Do?



It is used for: 
• Silicon wafer
• Lithium tantalate
• Ceramic substrate
• Silicon carbide wafer
and other semiconductor materials



Silicon carbide wafer can achieve mirror effect after polishing,and the surface has no scratches, spots and orange peel.


Silicon Wafer Mirror Polishing




Ceramics:Surface polishing of alumina, zirconia, fluorescent scintillator, strontium titanate, barium titanate, aluminum nitride and other products.

2. What Are The Advantages of The Semiconductor Silicon Wafer Polishing Machine?

1). It has four workstations, which are driven independently, and can be independently adjusted and controlled.
2). It is pressurized by a cylinder, and the pressure is precisely controlled.
3). This is a single-side precision polishing equipment. It adopts advanced mechanical structure and control method, and has high polishing efficiency and stable operation.
4). The whole machine adopts PLC+touch screen control system, equipment parameter setting and easy to operate.
5). It has high polishing efficiency and stable operation.
6). The whole machine adopts PLC+touch screen control system, equipment parameter setting and easy to operate.
7). The main motor adopts variable frequency speed control to realize the soft start and soft stop of the main engine.
8). The Vacuum base is driven by a servo motor to ensure the uniformity of polishing at each station on the premise of ensuring the polishing rate of the product.
9). Both the polishing plate and the upper pressure plate are equipped with cooling water cooling function, which reduces the deformation of the surface of the polishing plate.

3. Technical Specifications of The Semiconductor Silicon Wafer Polishing Machine:

Model

TY-9104PA

Lap Plate Diameter

Φ910mm

Block size

Φ360mm

Maximum part Diameter

Φ330mm

Plate cooling

Cooling water jacket

P. Plate

4 axles.(driving force system individually)

Applied pressure

By cylinder

Pressure range

30~150kg

Capacity

4 inch wafer x 24 Pcs

6 inch wafer x 12 Pcs
12 inch wafer x 4 Pcs

Plate Speed

5~60rpm

Pneumatic

0.5~0.8 Mpa

Machine size
1350*2250*2300mm
Weight
2500kg
Controller
Touch Screen (Proface)


4. Consumable Parts List of The Semiconductor Silicon Wafer Polishing Machine:


Ceramic plate
Belt
Engine oil
Polishing pad
Polishing liquid

5. Installation Requirements of The Semiconductor Silicon Wafer Polishing Machine

Water: pure water or tap water
Electricity: 7.5KW three-phase 380V/single-phase 220V
Gas: 0.6-0.8Mpa
Environment: The ground is flat, there is no vibration source around, and there is no dust.


6.  The Factory of Shenzhen Tengyu Grinding Technology Co., Ltd.







Shenzhen Tengyu Grinding Technology Co., Ltd. was located in Guangming New District, Shenzhen, China, with a registered capital of 5 million yuan, which plant area is about 13,000 square meters. It is an enterprise engaged in surface grinding and polishing technology. The company specializes in R&D, production and sales of various high-precision flat grinding equipment, flat polishing equipment, high-speed thinning equipment, 3D polishing equipment and its supporting consumables. Its products are widely used in precision processing of mechanical seals, electronic communications, ceramics, semiconductors, optical crystals, aerospace, automotive mold, LED, mobile phone accessories, hardware and other components. The customer base is spread all over the country and abroad, and its representatives include TF, MEEYA, Tongda Group, Hanslaser, and many other well-known companies.


7. FAQ

Q1: Are you trading company or manufacturer?
A: We're manufacturer. We have our own factory and experienced technicians.

Q2: What is your terms of payment?
A: T/T 30% as deposit, and 70% before delivery. We'll show you the photos of the products and packages before you pay the balance.

Q3: What is your terms of delivery and delivery time?
A:EXW, FOB, CFR, CIF, DDU, etc. Generally, it will take 7 to 20 days after receiving your advance payment.The specific delivery time depends on the items and the quantity of your order.

Q4: Could you provide technology support?
A: We're in this field more than 20 years. If there's any problem, please contact with us, we'll provide suggestion from our engineer to help you solve problem.

Q5: What is the MOQ of customized products?
A: We are manufacturer and can provide you small MOQ for customized products.

Q6: Do you test all your goods before delivery?
A: Yes, every products will be test before delivery.

Q7: How do you make our business long-term and good relationship?
A.:We keep good quality and competitive price to ensure our customers’ benefit, and we respect every customer as our friend and we sincerely do business and make friends with them, no matter where they come from.

Q8: Is there any quality guarantee?
A: We offer one year quality guarantee. We are responsible for the quality of our mechanical seals. 

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