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Lapping Consumables

Lapping consumables are commonly used consumables on lapping machines and polishing machines, and are more important media for realizing grinding and polishing processes. There are many types of them. There are grinding discs, lapping plate,grinding fluids, polishing pads, polishing fluids, cutting oils, grinding wheels...

Driven by the lapping machine, a certain grinding force is generated between the product and the grinding consumables, so as to achieve a good grinding effect .

There are also many kinds of grinding media. Different media have different cutting force and roughness. We choose grinding media according to product requirements.

We regularly replace grinding consumables according to production needs. Tengyu produces all the accessories and consumables used in the lapping machine, and can supply these materials in large quantities for a long time.

  • Wafer & semiconductor polishing slurry is a colloidal silica slurry developed especially for polishing ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and'Glass Photomask, Ferrite Ceramics, Ni-P Disk, Crystal, PZT Ceramics, Barium Titanate Ceramics, Bare Silicon , Alumina Ceramics, CaF2, Bare Silicon Wafer Rework, SiC Ceramics, Sapphire, Electronic Substrates, Ceramics ,Crystal. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.

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  • This is a polishing slurry that produces a mirror finish on all kinds of metals such as aluminum, stainless steel, and titanium.

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  • This is a Cerium oxide polishing powder, the polishing power for glass is used for high-speed polishing , such as:mobile phone glass,high-precision lenses, optical lenses, LCD screens, etc.

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  • Diamond slurry is widely used for rough grinding and fine grinding of sapphire, silicon wafer, ceramics, different metals and other materials.

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  • The application of the grinding wheels for wafer: Coarse and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, GaAs, GaN , Silicon carbide, lithium tantalate, etc

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  • The polishing pads can precisely polish cemented carbide, ceramics, glass, silicon wafer, silicon carbide, sapphire, lithium tantalate and other materials.

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