Lapping consumables are commonly used consumables on lapping machines and polishing machines, and are more important media for realizing grinding and polishing processes. There are many types of them. There are grinding discs, lapping plate,grinding fluids, polishing pads, polishing fluids, cutting oils, grinding wheels...
Driven by the lapping machine, a certain grinding force is generated between the product and the grinding consumables, so as to achieve a good grinding effect .
There are also many kinds of grinding media. Different media have different cutting force and roughness. We choose grinding media according to product requirements.
Polyurethane polishing pad is also known as cerium oxide polishing pad, red microdermabrasion, metallographic polishing leather, etc. It is mainly used in the mirror polishing of crystal, glass handicrafts, precious stones and crystal optics.
Diamond grinding disc can efficiently grind sapphire, silicon carbide, tungsten steel, cemented carbide, superalloy and other materials.
Grinding and polishing are two processes used to improve the flatness and roughness of the surface of the workpiece. In the actual application process, we usually use different plates to achieve this, but here I will introduce a special grinding&polishing plate, which can achieved Grinding and polishing at the same time.
What are the main components of the Lapping plate? Manufactured from a homogeneous mixture of synthetic resins, metal powder and key bonding/hardening. What is the function of the Lapping plate? The lapping plate enables efficient grinding and improve the flatness and roughness of the workpiece surface.
It can precisely polish cemented carbide, ceramics, glass, silicon wafer, silicon carbide, sapphire, lithium tantalate and other materials.
Polishing Slurry(Al₂O₃) is a colloidal silica slurry developed especially for polishing ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and'Glass Photomask, Ferrite Ceramics, Ni-P Disk, Crystal, PZT Ceramics, Barium Titanate Ceramics, Bare Silicon , Alumina Ceramics, CaF2, Bare Silicon Wafer Rework, SiC Ceramics, Sapphire, Electronic Substrates, Ceramics ,Crystal. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.