Lapping Machines

Lapping machine is a kind of equipment to improve the surface flatness and roughness of products. It is divided into single-sided lapping machine and Dual Face Lapping Machine. Single-sided lapping machine can only grind one side, while Dual Face Lapping Machine can grind two sides at the same time.Lapping machine was used in mechanical seals, aerospace, mobile phone electronic communications, semiconductor industry, metal and other industries. It has good grinding effect on stainless steel, tungsten steel, cemented carbide, zinc alloy, aluminum alloy, high temperature alloy, optical glass, ceramics, silicon wafer, silicon carbide, quartz and other materials.

Tengyu is a lapping machine manufacturer which specializing in the R&D and production. It is a high-quality manufacturer in China, with a production workshop of 6000 square meters, an office area of 2000 square meters ,a strong technical team and perfect after-sales service system.

The lapping machine produced by Tengyu has the following advantages:

1). With automatic lapping plate correction device, it can ensure the high flatness of the plate, and can also ensure that the workpiece has a high flatness after grinding;

2). It can be used for grinding or polishing, and the roughness after polishing can reach nanometer level.

3). It is a semi-automatic equipment. Except for manual loading and unloading, other operations can be performed automatically according to the parameters set on the control panel. This saves labor and improves efficiency.

4). The lapping machine sold by Tengyu is fully equipped, easy to operate, and can provide video teaching.

5). All accessories and consumables can be produced by Tengyu, and they are provided in complete sets, so there is no need to find other relevant suppliers.

Flat Grinding Machine
The Flat Grinding Machine is widely used for single-sided grinding and polishing of Seal ring, ceramic seal, stainless steel, tungsten steel, alloy blade, razor blade, silicon wafer, lithium carbonate, lithium niobate and other crystal materials and metal materials.
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Wafer polisher/CMP MACHINES
Applicable to Sapphire or SIC super-hardcover material polishing process, man-machine interface to facilitate the operation, the body to strengthen the support bar design, higher stability, with water cooling function.
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Double Side Lapping Machines
The Double Side Lapping Machines can grind silicon wafers, optical glass, aluminum alloys, titanium alloys, tungsten steel, stainless steel and other materials on both sides with high precision.
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Sapphire Lapping And Polishing Process And Machines
The Sapphire Lapping And Polishing Process And Machines is used for: • Sapphire substrate/wafer • Semiconductor wafer: silicon carbide, 12-inch silicon wafer, lithium tantalate, lithium niobate, etc. • Tungsten carbide parts • Ceramic parts • Valves • crystal glass • Oscillator part
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Single Sided Lapping Polishing Machine
A single-side grinding machine is a kind of common metal processing equipment, mainly used for grinding, polishing and trimming metal materials. It has the advantages of simple structure, convenient operation and high processing efficiency, and is widely used in machinery manufacturing, automobile manufacturing, aerospace, electronic appliances and other fields.
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Lapping & Polishing
What the Lapping & Polishing Machines Can Do? Lapping & Polishing is used for: • 4,6,8,12-inch silicon wafer • Sapphire substrate/wafer • Tungsten carbide parts • Ceramic parts • Valves • crystal glass • Silicon carbide wafer
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