Lapping machine is a kind of equipment to improve the surface flatness and roughness of products. It is divided into single-sided lapping machine and Dual Face Lapping Machine. Single-sided lapping machine can only grind one side, while Dual Face Lapping Machine can grind two sides at the same time.Lapping machine was used in mechanical seals, aerospace, mobile phone electronic communications, semiconductor industry, metal and other industries. It has good grinding effect on stainless steel, tungsten steel, cemented carbide, zinc alloy, aluminum alloy, high temperature alloy, optical glass, ceramics, silicon wafer, silicon carbide, quartz and other materials.
TY-9B Two-sided Grinder for Sapphire grind & polish both flat faces of the components at the same time.It is widely used for Quartz wafers, ceramics(Aluminum oxide, zirconium oxide, aluminum nitride, beryllium oxide, boron nitride, silicon nitride, silicon carbide, silicon nitride, indium sulfide, bismuth telluride, barium titanate, strontium titanate,、piezoelectric ceramics), optical glass, sapphire, alloy steel, stainless steel, tungsten steel, iron and other metals or non-metals.
TY-6B Dual Face Lapping&Polishing Machines grind & polish both flat faces of the components at the same time. It is widely used for Quartz wafers, ceramics(Aluminum oxide, zirconium oxide, aluminum nitride, beryllium oxide, boron nitride, silicon nitride, silicon carbide, silicon nitride, indium sulfide, bismuth telluride, barium titanate, strontium titanate,、piezoelectric ceramics), optical glass, sapphire, alloy steel, stainless steel, tungsten steel, iron and other metals or non-metals.
The fine grinding machine is widely used for single-sided grinding and polishing of optical glass, mobile phone glass, mobile phone logo, mobile phone card tray, 12-inch silicon wafer, aluminum alloy, stainless steel, valve plate, sealing ring, petroleum mechanical seal and other products.
The surface grinding machine is widely used for single-sided grinding and polishing of alumina ceramics, Zirconia ( PSZ) Ceramics,SiC Ceramics, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, seal ring, Stainless Steel, Titanium Alloy, Cemented Carbide,electric shaver blades,Mobile phone accessories, etc.
The high precision lapping machines is widely used for single-sided grinding and polishing of alumina ceramics, Zirconia ( PSZ) Ceramics,SiC Ceramics, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, seal ring, Stainless Steel, Titanium Alloy, Cemented Carbide, Tungsten Steel etc.
The single sided lapping machines is widely used for single-sided grinding and polishing of LED sapphire substrates, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, Light Guide Plates, Optical Cutting Valve Sheets, Hydraulic Compaction, Stainless Steel, Titanium Alloy, Cemented Carbide, Tungsten Steel and other materials.