The surface grinding machine is widely used for single-sided grinding and polishing of alumina ceramics, Zirconia ( PSZ) Ceramics,SiC Ceramics, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, seal ring, Stainless Steel, Titanium Alloy, Cemented Carbide,electric shaver blades,Mobile phone accessories, etc.
The high precision lapping machines is widely used for single-sided grinding and polishing of alumina ceramics, Zirconia ( PSZ) Ceramics,SiC Ceramics, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, seal ring, Stainless Steel, Titanium Alloy, Cemented Carbide, Tungsten Steel etc.
The single sided lapping machines is widely used for single-sided grinding and polishing of LED sapphire substrates, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, Light Guide Plates, Optical Cutting Valve Sheets, Hydraulic Compaction, Stainless Steel, Titanium Alloy, Cemented Carbide, Tungsten Steel and other materials.
The Flat Grinding Machine is widely used for single-sided grinding and polishing of Seal ring, ceramic seal, stainless steel, tungsten steel, alloy blade, razor blade, silicon wafer, lithium carbonate, lithium niobate and other crystal materials and metal materials.
Polyurethane polishing pad is also known as cerium oxide polishing pad, red microdermabrasion, metallographic polishing leather, etc. It is mainly used in the mirror polishing of crystal, glass handicrafts, precious stones and crystal optics.
Diamond grinding disc can efficiently grind sapphire, silicon carbide, tungsten steel, cemented carbide, superalloy and other materials.