It is suitable for surface grinding of high-precision large workpieces. Such as: plastic plate, ceramic, nickel alloy, zinc alloy plate, tungsten steel plate, aluminum alloy, stainless steel, engine case, light guide plate, etc.
What Double Side Lapping Machines can do? Applicable to thin hard and brittle materials such as metal sealing rings, sapphire, SiC, ceramics, glass grinding and polishing process, four-stage pressure control, to avoid damage to the processing of materials.
Wafer & semiconductor polishing slurry is a colloidal silica slurry developed especially for polishing ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and'Glass Photomask, Ferrite Ceramics, Ni-P Disk, Crystal, PZT Ceramics, Barium Titanate Ceramics, Bare Silicon , Alumina Ceramics, CaF2, Bare Silicon Wafer Rework, SiC Ceramics, Sapphire, Electronic Substrates, Ceramics ,Crystal. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.
This is a polishing slurry that produces a mirror finish on all kinds of metals such as aluminum, stainless steel, and titanium.
This is a Cerium oxide polishing powder, the polishing power for glass is used for high-speed polishing , such as:mobile phone glass,high-precision lenses, optical lenses, LCD screens, etc.
The Double Side Lapping Machines can grind silicon wafers, optical glass, aluminum alloys, titanium alloys, tungsten steel, stainless steel and other materials on both sides with high precision.