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  • It is suitable for surface grinding of high-precision large workpieces. Such as: plastic plate, ceramic, nickel alloy, zinc alloy plate, tungsten steel plate, aluminum alloy, stainless steel, engine case, light guide plate, etc.

  • What Double Side Lapping Machines can do? Applicable to thin hard and brittle materials such as metal sealing rings, sapphire, SiC, ceramics, glass grinding and polishing process, four-stage pressure control, to avoid damage to the processing of materials.

  • Wafer & semiconductor polishing slurry is a colloidal silica slurry developed especially for polishing ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and'Glass Photomask, Ferrite Ceramics, Ni-P Disk, Crystal, PZT Ceramics, Barium Titanate Ceramics, Bare Silicon , Alumina Ceramics, CaF2, Bare Silicon Wafer Rework, SiC Ceramics, Sapphire, Electronic Substrates, Ceramics ,Crystal. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.

  • This is a polishing slurry that produces a mirror finish on all kinds of metals such as aluminum, stainless steel, and titanium.

  • This is a Cerium oxide polishing powder, the polishing power for glass is used for high-speed polishing , such as:mobile phone glass,high-precision lenses, optical lenses, LCD screens, etc.

  • The Double Side Lapping Machines can grind silicon wafers, optical glass, aluminum alloys, titanium alloys, tungsten steel, stainless steel and other materials on both sides with high precision.

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