Products

Single Side Polisher
The single side polisher is widely used for single-sided grinding and polishing of alumina ceramics, Zirconia ( PSZ) Ceramics，SiC Ceramics, Optical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, seal ring, Stainless Steel, Titanium Alloy, Cemented Carbide, Tungsten Steel etc.
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Wafer Processing Equipment
The Applications of The Wafer Processing Equipment:Semiconductor wafer grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP.
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Ultra-Thin Grinding
The Applications of The Ultra-Thin Grinding:Ultra-Thin Grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP.
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Semiconductor Wafer Grinder
The Applications of The Semiconductor Wafer Grinder: Semiconductor wafer grinding or back-thinning of advanced materials, such as: SiC, GaAs, Sapphire, Si, GaN, InP. • Ultra-precision optical components, such as： ULE glass, High-energy particle scintillator, Fluorescent film, Projection glass.
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Wafer Grinder For Resin Material
Wafer grinder for resin material is very suitable for products with relatively high hardness, ultra-thin thickness and high degree of precision in flatness and surface quality. The compact design with advanced controls and process monitoring makes this an ideal machine for use in research & development or for low volume production of advanced components.
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Wafer Grinder Ceramic Substrate
Wafer Grinder Ceramic substrate is very suitable for products with relatively high hardness, ultra-thin thickness and high degree of precision in flatness and surface quality. The compact design with advanced controls and process monitoring makes this an ideal machine for use in research & development or for low volume production of advanced components.
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