Products

Grinding & Polishing Plates
Grinding and polishing are two processes used to improve the flatness and roughness of the surface of the workpiece. In the actual application process, we usually use different plates to achieve this, but here I will introduce a special grinding&polishing plate, which can achieved Grinding and polishing at the same time.
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Flat Lapping Plate
What are the main components of the Lapping plate? Manufactured from a homogeneous mixture of synthetic resins, metal powder and key bonding/hardening. What is the function of the Lapping plate? The lapping plate enables efficient grinding and improve the flatness and roughness of the workpiece surface.
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Polishing Pads For Sapphire
It can precisely polish cemented carbide, ceramics, glass, silicon wafer, silicon carbide, sapphire, lithium tantalate and other materials.
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Polishing Slurry（Al₂O₃）
Polishing Slurry（Al₂O₃） is a colloidal silica slurry developed especially for polishing ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and'Glass Photomask, Ferrite Ceramics, Ni-P Disk, Crystal, PZT Ceramics, Barium Titanate Ceramics, Bare Silicon , Alumina Ceramics, CaF2, Bare Silicon Wafer Rework, SiC Ceramics, Sapphire, Electronic Substrates, Ceramics ,Crystal. With excellent particle uniformity and dispersal, it delivers a high removal rate and damage-free polishing.
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Wafer polisher/CMP MACHINES
Applicable to Sapphire or SIC super-hardcover material polishing process, man-machine interface to facilitate the operation, the body to strengthen the support bar design, higher stability, with water cooling function.
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Silicon Carbide Wafer Thinning Machine
Silicon Carbide Wafer Thinning Machine is mainly used for thinning of substrate materials such as silicon wafer, gallium arsenide, silicon carbide ceramics, zirconia ceramics, graphite, lithium tantalate and so on.
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