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  • Diamond slurry is widely used for rough grinding and fine grinding of sapphire, silicon wafer, ceramics, different metals and other materials.

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  • The application of the grinding wheels for wafer: Coarse and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, GaAs, GaN , Silicon carbide, lithium tantalate, etc

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  • The high precision vertical wafer grinding machines can grind third generation semiconductor materials such as SiC, GaN, GaAs, Si, ZnO. DL-GSD series is a self-made grinding machine in China, and its performance has reached the world standard.

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  • The polishing pads can precisely polish cemented carbide, ceramics, glass, silicon wafer, silicon carbide, sapphire, lithium tantalate and other materials.

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  • The Sapphire Lapping And Polishing Process And Machines is used for: • Sapphire substrate/wafer • Semiconductor wafer: silicon carbide, 12-inch silicon wafer, lithium tantalate, lithium niobate, etc. • Tungsten carbide parts • Ceramic parts • Valves • crystal glass • Oscillator part

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  • Diamond grinding disc is an efficient grinding tool, widely used in stone, ceramic, glass, metal and other materials grinding processing. It is made of high quality diamond powder and high strength metal powder, with high hardness, high wear resistance, high precision and other characteristics, can quickly and smoothly grind various material surfaces, improve processing efficiency and product quality.

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