Products

Single Sided Lapping Polishing Machine
A single-side grinding machine is a kind of common metal processing equipment, mainly used for grinding, polishing and trimming metal materials. It has the advantages of simple structure, convenient operation and high processing efficiency, and is widely used in machinery manufacturing, automobile manufacturing, aerospace, electronic appliances and other fields.
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Full Automatic Wafer Grinder
Full Automatic Wafer Grinder is a kind of high precision and high efficiency grinding equipment, mainly used in semiconductor, optoelectronics, microelectronics and other fields of wafer processing.
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Semiconductor Silicon Wafer Polishing Machines
What the Semiconductor Silicon Wafer Polishing Machines Can Do? It is used for: • silicon wafer • lithium tantalate • Ceramic substrate • Silicon carbide wafer and other semiconductor materials
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Small Polishing Machine For Experiment
Small Polishing Machine for experiment is widely used in LED sapphire substrates, optical glass wafers, ceramics, quartz wafers, molds, compressor valves, hydraulic seals, light guide plates, optical skewer joints.
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Undertake Grinding&Polishing Processing
Our company undertakes grinding and polishing of various materials: processing or contracting We have a 5000㎡ processing workshop, more than 30 sets of high-precision grinding and polishing equipment, and you can place an order after the sample! Feel free to inquire at any time: grace@lapping-machine.com WeChat：13622378685/liujiexia88
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Double Sided Polishing Machine for Optical Glass
Equipment Name: FD-15B Precision Double Sided Grinder Equipment use: This machine is mainly used for semiconductor materials, optical glass, magnetic materials, dielectrics, piezoelectric materials, polycrystalline materials, non-polycrystalline materials, High-precision grinding and polishing of ceramic sheets, ultra-thin metal materials and other hard and brittle materials.
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